IFP Component - OPS Module

OPS Module - OPS-i730

  • Plug-and-Play OPS - Simplifies IFP setup/upgrades with slot-in modules.
  • Modular Computing - Swap OPS units tool-free, no cables or extra devices.
  • All-in-One Power - Turns IFPs into standalone interactive platforms.
  • Space-Smart Design - Compact OPS integrates seamlessly behind screens.
OPS Module

FEATURES IN DETAIL

Alt Text

All Aluminum Material

All-aluminum integrated heat dissipation, wide groove design on the body surface for better heat dissipation, including double copper tubes and double radiators
Alt Text

Double Cooling Fan

Double cooling fan to dissipate the heat generated by electronic components and maintain an optimal operating temperature.
Alt Text

Ultra Light

At the same time of high performance, the lightweight module design makes the installation very convenient

Features

  • The board-mounted 4G D4 has a 128-bit independent display, which is the only one in the industry that can achieve a thickness of 30MM

  • TPY-C interface
  • Maximum support for 6 3.0USB
  • Anti-fouling, dust-proof, fully enclosed body, preventing dust from affecting product life
  • Strong anti-static (static cloth and cotton to prevent short circuit of OPS caused by static electricity)
  • 8-layer PCB board with strong performance and double-layer design
  • Low CPU temperature and strong performance (Turbo on)
  • Normal operation at minus 15°-75°
  • On-board WiFi, 2-in-1 audio

Product Display Diagram

Image
Image

Let’s Talk!

We are committed to promoting education and business development by providing professional hardware and software, providing solutions based on personalized needs.
Quick Links
Contact Us

+86 199 2682 0559

Email: [email protected]

Address: 3rd Floor, Building 7, Skyworth Innovation Valley, Baoan District, Shenzhen, China 518101